1. TSMC faces intensified challenges at its Arizona plant due to a labor shortage, requiring temporary workers from Taiwan; 2. Local unions oppose the move, citing concerns about workplace safety and job opportunities for American workers; 3. The conflict highlights broader tensions in TSMC's global expansion strategy amid U.S.-China tech competition.
Recent #Global Expansion news in the semiconductor industry
1. TSMC's Arizona semiconductor plant faces challenges including high costs and skilled labor shortages; 2. U.S. unions oppose the company's plan to bring Taiwanese workers, citing visa rule violations; 3. The $40 billion project experiences delays and cost overruns, impacting global chip supply chain strategies.
➀ KeyASIC, a leading ASIC design services company, has partnered with AnySilicon;
➁ The collaboration aims to expand KeyASIC's marketing reach;
➂ Access to AnySilicon's extensive network of potential customers seeking ASIC design solutions is provided.
➀ The semiconductor packaging and testing industry is crucial in the semiconductor supply chain, with traditional giants like OSAT facing challenges from advanced packaging technologies.
➁ Companies like OSAT leaders such as OSAT, Amkor, and Chipmos are expanding globally and focusing on advanced packaging to maintain their competitive edge.
➂ Key strategies include overseas expansion, investment in new factories, and technological innovation to meet the growing demand for advanced packaging.
➀ Graphcore, the AI chip designer based in Bristol, is set to add 75 new jobs, increasing its workforce by 20% to approximately 450 people. ➁ The roles span various disciplines such as silicon design, hardware, datacenter infrastructure, software, and AI research. ➂ Graphcore's CEO, Nigel Toon, emphasizes the company's commitment to being a leading-edge workplace in its field.
➀ Wayve, a UK ADAS developer, has expanded its US operations with an office in Silicon Valley and a driver assistance testing programme in San Francisco and the Bay Area; ➁ This marks Wayve’s first on-road trials outside the UK and a significant step in developing AI software for global vehicle assistance features; ➂ The testing will help Wayve’s AI Driver product expand geographically, building a scalable driving software foundation for diverse conditions across multiple countries.
➀ Linktel Technology showcased several new 800G optical modules including OSFP 2FR4, QSFP-DD XDR8, and QSFP-DD 2FR4, along with its latest 1.6T solution, attracting wide discussion and attention from industry customers and visitors; ➁ The company's product line has been enriched with 800G products and solutions for data centers, with new 400G products added; ➂ Linktel has been investing in R&D, releasing products like 400G/800G silicon photonics solutions, 800G LPO, and LRO products, aiming to enhance network efficiency and stability in data centers; ➃ Linktel has established long-term partnerships with global data center operators and has expanded its global presence with manufacturing, R&D, and business centers in multiple locations; ➄ The company has completed the construction of a new headquarters in Wuhan, which is a multifunctional comprehensive park to support production and operations.
➀ Intel CEO Pat Gelsinger outlines the future direction following a board meeting; ➁ Plans to establish Intel Foundry as an independent subsidiary; ➂ Maintains current leadership team and adds independent directors for governance; ➃ Continues Smart Capital approach for financial flexibility; ➄ Adjusts manufacturing expansion plans and delays projects in Poland and Germany; ➅ Expands in Europe through Ireland and maintains commitment to U.S. manufacturing investments.
1. 20 teams selected across various categories; 2. Support includes global exhibition, mentoring, and promotional video production; 3. Special awards from partner companies offer additional opportunities.
1. Micron is planning to increase production of HBM3E memory globally to enhance its market share in the HBM sector. 2. The expansion includes boosting production in Taiwan, expanding R&D operations in the U.S., and initiating HBM3E memory production in Malaysia.